Cross-slotted structure: Having been patented for the NexXxoS XP in 2004, the cross-slot technology in the cooling plate was developed even further. An even finer structure of fins and channels now ensures stunning performance. The remaining pins are 0.5x0.5mm wide and have a height of 2.5mm. With this technology, it is possible to transfer great amounts of thermal energy very quickly from cooling plate to coolant..
Backflow channels: The patented backflow channels were also improved and optimized for maximum flow rates. Coolant can now be drained very efficiently above the pin structure, reducing flow resistance and improving cooling performance.
Injection: A multitude of approaches for ideal coolant injection into the cooling structure exist, and many of them show great potential in computer simulation.
Alphacool went one step further, and has actually realized many different technologies and tested them under real-life conditions. These prototypes were combined with different backflow possibilities, until an ideal solution was found: Slotted acentric injection in combination with backflow channels in opposite directions allowed a performance improvement which also worked on larger chips and Multi-core processors.
Coolant recirculation: Unlike many current water blocks, where the recirculation of the coolant was only seen as a secondary issue, the NexXxoS XP³ was also optimized in this point. Hence it features an unusually large collection reservoir all along the pin structure of the water block. This allows coolant flow from all directions, removing it from the pin structure in a highly effective manner.
Size: Both in regard to cooling plate dimensions (56x56mm) as well as top plate dimensions (57x67mm, plus mount), the XP³ has grown to be a full-size water block. Main advantage of the larger dimensions is optimal cooling of multi-core processors.
Mount: The XP³ features a circumferential elevated strip, offering a secure hold for the mounting plate. This new feature allows switching of the cooling plate without having to disassemble and open the water block.
With water blocks from the competition, installation of a different mounting plate is often a hassle without the necessary technical know-how, and not many users have the experience to be able to disassemble a complicated water block and reassemble it correctly without damaging it.
Such worries are now thing of the past! Included with the water block come two mounting plates, one for installation Intel sockets, the other for use with AMD processors.
Versions: Two versions will be available upon release: For budget-oriented users, the affordable entry-level version with Acetal is the right choice. For those looking for something a bit more advances, a version with brass top and elegant black nickel plating is available.
Cooling performance of the Acetal version is only approximately 2°C behind the performance of the brass version, meaning that the Acetal version delivers top-notch performance at an affordable price.
Extent of delivery:
1x Assembled CPU water block
1x Mount for Intel Mainboards sockets 775,1155,1156,1366,2011,1150
1x Mount for AMD Mainboards AM2 and AM3
1x Thermal compound and mounting material
Weight: 0,279 kg
Dimensions CPU water block: 57x67x14mm respectively. 63x73x14mm at the mounting strip
Compatible with: Intel sockets 775,1155,1156,1366,2011 and AMD AM2 and AM3
Connection threads: 2x G1/4”
The mounting manual for this water block is available for download here
The water block is shipped in a protective packaging with specially cut foam inserts; the cooling plate has a protective foil attached to it. This foil must be removed before installation of the water block.