The HEATKILLER® CPU Rev3.0 LT sets a new benchmark in cooling performance, build quality and user friendliness. The waterblock was designed with the newest CPU generations in mind.
Central flow design, paired with a sophisticated nozzle plate and an extremely fine cooling geometry give the waterblock outstanding cooling performance while still having a very low flow resistance. The baseplate can geometrically adapt itself to the CPU. When used on a Quad Core CPU a distributor plate is included which directs the flow of coolant parallel to both DIEs of the CPU.
The modular design allows easy opening of the HEATKILLER®, the change of the mounting plate to allow installation on another socket is done easily and quickly. Separately available mounting plates and replacement parts ensure, even after years, perfect operation and performance.
The cooling geometry is made from electrolyte copper, the cover is made from high-quality POM. The mounting plate and design applications are made from stainless steel.
Material: Electrolyte copper, POM, stainless steel
Dimensions (block): 59 x 59 x 17,5mm
Weight: approx. 150g
Pressure tested: 5 bar
Seal: EPDM 75 (max. 150°C)
Thread size: G1/4" (DIN ISO 228-1)
Compatible with Intel socket 1155/1156
Extent of delivery:
1x Watercool HK CPU LGA 1155/1156 Rev. 3.0 LT