Barrow Enhanced Thermal Kit For Graphics Card Blocks

Barrow Enhance Thermal Conductivity Suite for graphics card water cooling

 

Features:

- Under full load, when comparing the temperature of the set of heat conduction enhancement before and after use, the temperature will decrease by 30°C and the strength is powerful.

- The stability of the thermal grease is good over time, which will not affect the thermal conductivity of the thermal grease and thermal pad even with long-term use.

- The thermal grease has excellent diffusion performance without spreading manually. When applying the thermal grease at the core it will cover the core evenly after installing the water block.

- The gap between the water block and the chip can be filled effectively by the thermal grease and thermal pad, which can accelerate the heat conduction rate and cool the chip.

 

Technical Data:

Thermal Grease:

Thermal conductivity: 13.4w/m-k

Thermal resistance: <0.001°C-IN²/W

Operating temperature: -30~240°C

Density: 2.5g/cm3

Conductivity: No

 

Thermal Pad:

Thermal conductivity: 8w/m-k

Thickness: 0.5mm/1.2mm

Hardness: 35±5HA

Operating temperature: -40~200°C

Conductivity: No

 

Included:

4 x 60x15mm 0.5mm thick Inductance strips

5 x 52x15mm 1.2mm thick VRAM strips

1 x 0.5g Heat Conduction Enhance Thermal Grease